Silicon Box unveils US$2B semiconductor packaging facility in Singapore

SINGAPORE – Silicon Box, a Singapore-based semiconductor integration start-up launched its US$2 billion advanced semiconductor manufacturing facility, in Tampines creating more than a thousand jobs and boosting the country’s status as an advanced manufacturing hub.

The Silicon Box foundry is a “world-first” focusing on true chiplet-based semiconductor manufacturing – the ability to build single chip packages through the interconnection of multiple, heterogeneous, modular units (chiplets), a company spokesperson tells Packaging Insights.

Silicon Box’s founder and CEO, Dr. Byung Joon Han, tells us that the company is well poised to solve the “unique” challenges for chiplet adoption, which are essential to power emergent technologies.

“This new facility is well poised to solve the unique challenges for chiplet adoption, which is critical to meet market demands of emerging technologies.” Said Dr. Han.

“Our proprietary interconnection technology will not only shorten the design cycle of chips but also lower new device costs, reduce power consumption and enable faster time-to-market for industry partners like artificial intelligence, data centers, and electronic vehicles.”

Silicon Box uses panel-level processing focusing on the shortest-ever chiplet-to-chiplet interconnection technology, using sub-5 micron technology to achieve high-performance integration.

The company says it can accommodate six to nine times more units depending on tile size compared to other advanced factories that use conventional wafers – making it possible to cut the production cost of chips to one-fifth.

Additionally, Silicon Box’s proprietary advanced chiplet interconnection technology reduces package sizes, improving electrical performance by over 50% and lowering power consumption by more than 40%.

“Our proprietary method sets a new standard for design flexibility and electrical performance at low cost,” explains Dr. Sehat Sutardja, co-founder and chairman of the board.

“This agility in semiconductor design cycles enables the industry to take advantage of the chiplet concept and bring designs that double computing performance at up to four times lower costs for graphical processors and high-performance computing chips, and up to half the cost for more widely consumed mobile processors.”

Supported by the Singapore Economic Development Board (EDB), the advanced chiplet interconnection company also plans to upskill and employ up to 1,200 highly skilled people with computer science, engineering and design backgrounds.

In line with Singapore’s goal to expand its manufacturing sector by 50% by 2030, this will further strengthen its appeal as a preferred destination for AI and semiconductor companies seeking to diversify their manufacturing supply chains amid growing geopolitical tensions.

By embracing this new technology, Singapore aims to solidify its position as a global leader in high-performance technology and enhance its attractiveness to industry players.

The establishment of this factory is poised to have a significant impact on Singapore’s semiconductor sector.

It is expected to boost the industry’s growth and elevate the country’s standing as a formidable player in the global market.

This development will contribute to the nation’s economic expansion and support Singapore’s long-term vision of expanding its manufacturing base.

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