US – German multinational chemical and consumer goods company, Henkel has completed the acquisition of US-based advanced materials start-up NBD Nanotechnologies Inc. (NBD Nano).
Based in Boston, Massachusetts NBD Nano has expertise in developing surface properties such as repellency for plastics or optical coatings for displays.
With this acquisition, Henkel aims to strengthen the position of its Adhesive Technologies business unit in the area of functional coatings.
Through its proprietary platform technology, NBD Nano creates coatings that reduce fingerprint visibility for glass and impart stain repellency for plastics, textiles and other materials.
NBD Nano’s knowledge can be used in manifold applications – from electronics and consumer goods to automotive and packaging.
Its product offerings include Invisiprint coating additives that provide fingerprint management and reduction of odor and stain-causing bacteria on displays and RepelFlexTM coatings that significantly reduce odor and stain-causing bacteria on common-use plastics such as electronic accessories and films.
Michael Todd, Global Head of Innovation at Henkel Adhesive Technologies said: “We believe that our acquisition of NBD Nano will accelerate the commercialization of their cutting-edge technologies.
“Their demonstrated innovations in coatings for the electronics and accessories market combined with Henkel’s global footprint will extend the reach for broader application of NBD Nano’s solutions in the commercial marketplace.”
New semiconductor capillary underfill for advanced silicon node flip chip applications
Meanwhile, the company has announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications.
The material, Loctite EccobondUF 9000AG, enables advanced silicon (Si) node flip-chip integration by providing robust interconnect protection and compatibility with high-volume manufacturing environments.
While the company has well-established pre-applied paste and film underfill materials for leading-edge chip technologies, this development broadens Henkel’s post-applied capillary portfolio for flip chips with advanced node scaling.
Loctite Eccobond UF 9000AG breaks past conventional formulation paradigms, balancing high filler loading and fast flow capability to meet the extreme reliability and volume demands of next-generation semiconductor device packaging.
Already proven in mass production environments with the latest node and currently under evaluation for next-generation node flip chip packages, the product is an epoxy-based underfill designed with a high glass transition temperature (Tg) and ultra-low (<20 ppm) coefficient of thermal expansion (CTE).
Though among the market’s highest filled (>70%) formulations to enable excellent bump protection, it still underfills 30% faster as tested against previous-generation and competitive CUFs.
In addition, Loctite Eccobond UF 9000AG provides high fracture toughness, low warpage, and MSL3 reliability on dies ranging in size from 10mm x 10mm to 20mm x 20mm.
“This innovative solution represents a major breakthrough for the future of advanced node flip chip device processing and end product performance,” said Ramachandran Trichur, Henkel’s Global Market Segment Head for Semiconductor Packaging Materials.
“Historically, high filler loading has correlated with slower underfilling rates. Loctite Eccobond UF 9000AG moves beyond this boundary.
“It gives integrators of the latest node – and potentially next generation – node chips a more comprehensive low CTE, high flow solution that marries productivity and thorough solder joint protection.”
The increasing use of the latest node flip chips and the projections that next-generation node scaling devices will be in volume production by year’s end underscore the immediate requirement for a proven, reliability-enhancing chip protection solution.
Loctite Eccobond UF 9000AG meets the challenging performance metrics of advanced mobile devices and, having passed harsher thermal cycling level C testing (-65° C to 150° C), may also be a suitable candidate for certain automotive electronic and computing applications.
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